… SM 650 – The bonding solution for small budgets

Our bonding systems follow the trend of recent years, which increasingly dispenses with pinning of the press packs in favor of higher accuracy, as mechanical wear of pins and tool bushes no longer occurs, as well as high flexibility in the choice of format if necessary.

The current SM 650 model allows all formats from 220 x 230 up to a maximum of 560 x 650 to be joined by means of 6 welding points with infinitely variable width adjustment
( optionally 8 ).

The work process runs automatically after the stack is placed on the shuttle table system. The heating and cooling phases of the bonding process are controlled by a processing program from the internal Misubishi PLC.

Operator input and program management are carried out conveniently via a touchscreen, which also changes the screen backlighting,
the user of the status or indicates user inputs to be made.